Intel Motherboard | AMD Motherboard

Micro-Star International (MSI), one of the leaders in motherboard manufacturer launches its latest P35 Diamond motherboard based on Intel P35 Express chipset and the new-generation DDR3 structure. The new MSI P35 Diamond motherboard includes several exclusive features and the newest technology for upgrading future models offering its consumers to experience the advantage of “Ready for PC2008”.

45nm & DDR3 Ready Guarantee the Outstanding Performance
The new MSI P35 Diamond motherboard supports the latest Intel FSB1333 and the upcoming 45nm multi-core processors which include the hottest Core 2 Quad/Duo/Extreme and other Intel processors based on Core architecture. Not only that, this Intel motherboard also supports the next generation DDR3 memory structure as well, providing more advantages in performance and possibilities when overclocking.

Exclusive Cooling Solution "Circu-Pipe"
The new MSI P35 Diamond series is also equipped with exclusive fanless cooling design called “Circu-Pipe”. The Circu-Pipe offers a heat reduce efficiency of more than 20% after 2 hours full-load operation compared with the former heat-pipe design. Its fin-typed heatsink around the heat-pipe not only reduces the heat efficiently but also saves space to make sure the MSI P35 Diamond will not cause any structure conflict or problems from larger CPU cooler or video cards.

Perfect Listening Experience from X-Fi Xtreme Audio
Besides its performance, the MSI P35 Diamond delivers the best listening experience. The MSI mitherboard comes with the SoundBlaster X-Fi Xtreme Audio card with Creative hardware audio codec which fully support the 24-bit Crystalizer and the CMSS-3D to provides stunning surround sound from stereo speakers and headphone.

Make Internet Calls through MSI SkyTel
Another exclusive feature of MSI P35 Diamond motherboard is the “MSI SkyTel” which allows users to use common phone set to make internet calls. There’s no need to buy additional headset or VoIP accessories when using the MSI SkyTel. Users can just plug the legacy phone set in the P35 Diamond-based PC and make internet calls around the world using the Skype™ application.

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Intel is busy working on two enthusiast features for the X38 chipset before the launch next month. Not content by having two x16 PCI Express 2.0 slots with CrossFire support, Intel is going to take on nVidia’s SLI memory technology with what it calls Extreme Memory. This is the same concept as nVidia’s SLI memory, although Intel is only going to certify DDR3 modules, DDR2 won’t be considered. According to the news report, Intel is already working with Kingston and OCZ and samples should be available in late September. The good news is that the Extreme Memory modules should also be compatible with the P35 chipset, as long as your board supports DDR3 modules, as well as Intel’s next generation mobile performance chipset.
Intel is also working on a software application similar to nVidia’s nTune, which is called Extreme Tuning. This enables you to adjust BIOS settings from with in the OS and this makes for easier overclocking for those not familiar with the BIOS. However, Extreme Tuning is only for the X38 chipset, but hopefully Intel will release it for other chipsets as well. It will be customizable by the motherboard partners to fit with their choice of colour and design.
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Systemax and VIA announced a new energy efficient desktop PC. This computer is powered by a 1.5GHz VIA C7-D desktop processor and VIA motherboard for the US market. This processor has a maximum power consumption of 20W, along with the low-power VIA pc2500 motherboard and VIA CN700 digital media chipset with an integrated VIA UniChrome Pro II graphics processor.
This new Systemax PC model is available at several US online retail stores in two versions, one with Microsoft Windows XP Home for US$ 299.99, while the other is available for US$ 399.99 with Microsoft Windows XP Professional.
Here is the specification of this computer :

• Processor : VIA C7-D 1.5GHz
• Chipset : VIA CN700 Digital Media IGP / VT8237R Plus
• Graphics : VIA UniChrome Pro II
• Memory : DDR2 400/533 512MB up to 2GB

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AMD today silently cut prices on its current Opteron processors. The price cuts affect single and dual-core Opteron Socket F and 940 processors. Seven boxed AMD Opteron processors for Socket 940 have received price cuts including dual-core models 290, 285, 280, 275 and single-core models 256, 254 and 252. Five Opteron 8000 and eight Opteron 800 models also receive price cuts. These models are configurable in multi-CPU configurations with more than four CPUs. The price cuts affect tray processors and not retail box ones. Eleven dual-core Opteron 2000 series processors receive cuts, including the low power HE models. These are Socket F processors for dual processor configurations. Existing users with Socket 940 systems can rejoice as the Opteron 200 series receive price cuts as well.
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Intel plans to unleash its Penryn family processors next quarter, shortly after AMD releases Barcelona. Penryn is a base of all 45nm Core 2 micro architecture products, including quad-core Xeon Harpertown, quad-core Core 2 Yorkfield and dual-core Xeon, Core 2 Wolfdale processors. Intel improves existing Wide Dynamic Execution, Advanced Smart Cache, Advanced Digital Media Boost and Intelligent Power Capability, technologies that previously made its debut with Conroe and Merom. Intel expects SSE4 optimizations to deliver performance improvements in video authoring, imagine, graphics, video search, off-chip accelerators, gaming and physics applications.
Mobile Penryn processors is featured enhanced power saving technologies. The new technology in the mobile Penryn is a deep power down state. Using this technology, Intel claims significant power savings in idle modes for extended battery life with the new power state. For servers and workstations, Intel has designed Harpertown with additional headroom for the front-side bus. Intel plans to debut Penryn-based Xeon DP, MP and UP processors with 1333 MHz front-side bus, but the architecture has headroom for up to 1600 MHz front-side bus. Penryn-based quad and dual-core Xeons will have three thermal envelopes. Quad-core Harpertown Xeons will have 50, 80 and 120-watt TDP ratings while dual-core Wolfdale Xeons have 40, 65 and 80-watt ratings. And the desktop Core 2 and Core 2 Extreme processors have less thermal bins. Quad-core Yorkfield models have 95 and 130-watt TDPs while dual-core Wolfdale models have a single 65-watt TDP. Intel hasn't set thermal ratings for its mobile Penryn processors yet.
Following Penryn is a new Nehalem architecture, based on 45nm with Intel's new QuickPath technology, formerly known as common-system interface. Nehalem is set for a 2008 introduction, beginning with the Xeon family for servers and workstations. Intel plans to shrink Nehalem to 32nm with the Westmere core. Following Westmere is Sandy Bridge, a new micro architecture based on 32nm.
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AMD has introduced two new Opteron processors with higher clock speeds and has dropped the power consumption of the preceding flagship models with 3.0 GHz. AMD squeezes more clock speed out of its dual-core architecture as the company is putting the finishing touches on its new Barcelona quad-core processor, which is due for customer shipment during this quarter. The new dual-core top-of the line versions are the 2P 2224SE and the 4P 8224SE models are both clocked with 3.2 GHz and both rated with a thermal design power of 119 watts. Compared to Intel's dual-core Woodcrest processors, AMD promises a performance advantage between 17 and 37%, depending on the benchmark.
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ECS has announced the release of three motherboards, there are G31T-M , P33T-A and 945GCT-M2/1333. All of these motherboards already supported FSB up to 1333MHz. Both of G31T-M and P33T-A use G31 chipset and support up to 4GB of dual-channel DDR2 800 memory. The G31 chipset makes both of them have integrated Intel GMA 3100 (Intel GMA 3100) graphics and deliver Intel Core 2 Quad / Core 2 Duo processor support. The integrated graphics core supports Microsoft DirectX 9.0c and Shader Model 3.0 (software only) to deliver strong performance for multimedia applications and some gaming. For upgrade its graphics performance, ECS provides PCI Express x16 that featured by ECS EDGI. technology for digital multi-display output. The G31T-M motherboard has micro-ATX form factor and it is designed for entry-level users and for general usage, while the ATX form factor P33T-A is designed for performance users on a budget.
The ECS 945GCT-M2/1333 motherboard also has a gaphics onboard, because it uses Intel 945GC chipset. This motherboard already supported 1333MHz FSB, and dual-channel DDR2 667 memory.
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Three days ago (exactly in 1st August, 2007), ECS has announced the release of its G31 express chipset series motherboards – the G31T-M and P33T-A. Both of thoose computer motherboards deliver Intel Core2 Quad / Core2 Duo processing power, responsive integrated graphics with the Intel GMA 3100 graphics core and a PCI Express x16 slot for scalable high-end graphics card support. The G31T-M’s, micro ATX form factor, is designed for entry-level users for general usage. In the other hand, The P33T-A’s ATX form factor, is designed for performance users on a budget. The computer motherboards come ready to support the Windows Vista Premium and deliver maximum multi-tasking performance to a variety of users. Both of them also support 6-channel high definition audio output to deliver premium digital sound and advanced features such as multiple audio streams and jack sensing. This gives these two computer motherboards the capability to be the heart of digital entertainment systems for a complete multimedia experience. Finaly, ECS G31 series motherboards provide a powerful and economical computer platform that smartly addresses the needs of a wide range of users.
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Back in February of this year, we took a look at the AMD 690G chipset and praised it for its affordability, power efficiency, and strong performance relative to its competition. Now, this chipset is back with an update. AMD optimized this chipset further through some BIOS and software level enhancements that result in marked performance gains in a number of situations and also introduce some new features.
AMD claims the new 690G chipset is now capable of smooth HD DVD and Blu-ray playback at 1080p. Unfortunately, you won't find AMD's Universal Video Decoder in it. Instead, AMD says it's been able to smooth high definition video playback through "driver streamlining". To ensure smooth playback with all HD DVD and Bluray movies at their maximum resolution, you will need at least an Athlon X2 4600+. Not only that, AMD recommends dual-channel memory configurations of at least DDR2-667, and a minimum of 1GB of memory for playback in Windows XP, and 2GB for Vista.
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AMD's latest roadmap reveals more details about the next-generation of AMD's Integrated Graphics chipset, it is RS780 chipset. This chipset is targeted for comsumer and commercial desktop platform. AMD also designed this RS780 to supports Socket AM2+ processors with HyperTransport 3.0. The new graphic core on it, had supported AMD's Universal Video Decoder (UVD), a technology for hardware acceleration of H.264 and VC-1 video formats. Not only that, The RS780 chipset also supports DisplayPort, DVI and HDMI digital video output interfaces and has integrated audio controller for simultaneous audio and video output over HDMI. The chipset also integrates HDCP support. Additionally, the chipset supports TV-out, VGA and LVDS outputs. The graphics core also has two independent display controllers for dual independent displays. The local frame buffer feature will make a return on the RS780, allowing manufacturers to equip the graphics core with dedicated video memory. Users that prefer more 3D graphics power can install an external graphics card uses a PCIe 2.0 x16 slot. The RS780 will also have additional PCIe 2.0 lanes for lesser slots.
On the sothbridge side, this RS780 chipset will be paired with the SB700. The SB700 only supports PCI, because all of PCIe functionality has moved to the northbridge side. AMD increases USB support to 12 USB 2.0 ports plus an additional 2 USB 1.1 ports. This new southbridge supports up to six SATA 3.0 Gb/s ports with RAID 0, 1 and 10 support. SB700 chipset also supports IDE port, but AMD designed this port for double duty, there are as a physical PATA port or as a HyperFlash (The AMD's technology name for Intel's Turbo Memory competitor).
RS780 chipset has one minor difference if compared between commercial and consumer platform. For commercial platforms, AMD designates a Broadcom BCM5761 as a managed NIC to allows remote management. This technology is similar with Intel's AMT technology. AMD also recommends a TPM 1.2 module for greater security.
Info : AMD

The upcoming RD790 motherboard from Gigabyte is GA-M790-DQ6. But, causes it is not production yet, so some changes might still happen. The disappointing change is, Gigabyte had decided to remove FireWire 800 support from this AMD motherboard. On the rear panel, Gigabyte also removes the parallel port and it is replaced by two mounted eSATA ports. But, If you still need this parallel port, don't worry, Gigabyte still has added an internal connector for it and supplies one with a long cable in the box with the motherboard.
The heatpipe cooling system has been changed to be a better version with two instead of one heatpipes and some other modifications. Not only that, Gigabyte puts the power regulation on the motherboard all in a stright line which it easier to produce an efficient cooling solution. Finally, the GA-M790-DQ6 features AMD RD790 chipset and it supports HyperTransport 3.0 and AM2+ CPU’s.
Info : Gigabyte

DFI introduced yesterday the latest addition to its LANParty extreme motherboard line, the LANParty UT P35-T3R. The board adopts P35 + ICH9R chipsets as north and south bridge. Further, P35 supports DDR3 memory and Intel's next generation 45nm process CPUs. Known for innovation, DFI is also introducing with this motherboard, a whole new idea of external chipset cooling assembly.

The secret weapon: DFI unique heat pipe assembly
The designer of DFI LP UT P35 series has created a whole new "weapon", a heat pipe assembly from SB, NB then extend to PWM. The design of DFI's new heat pipe is totally different to others in market.
It uses a copper-made pipe to connect independent heat sinks of SB, NB and PWM together. Then, there will be an extension joint (Transpiper) to carry the heat out from the chassis. The Transpiper can be extended to where outside the PSU fan. That means the air flow from the PSU fan will be help to carry out the heat from Transpiper. Otherwise, the heat air flow will be stuck inside the chassis and that will jeopardize the stability of the system. This is a magnificent breakthrough of heat pipe assembly design.

Unique arrangement for Crossfire + Physics rendering
Since the Physics rendering technology has been revealed in PC market, gamers are all to pay close attention to it. Meanwhile, DFI was put it into LANParty motherboard as an advance features and that shows the gigantic power of Crossfire + Physics rendering. But 3 VGA cards bring a lot of heat as the same time. Hence, the arrangement of 3 VGA slots (2 CF + 1Physcis) seems especially essential for the system. If the spaces between 3 VGA slots are not enough, that'll cause heat dissipation problems. Therefore, DFI propose a perfect solution for that; the designer separated each of the slots with 2 additional PCI slot space. That means the 3 VGA slots located evenly in the board. That's a big improvement for efficient heat dissipation of VGA area between those "thick cards"(ex.1900, 2900).

Ultimate 8-phase Digital PWM
DFI is never satisfied to use any components of inferior quality. For this brand new model LP UT P35-T2R, DFI chooses to use an utmost 8 -phase Digital PWM in place of the advance 6-phase PWM. A digital PWM uses components to supply stabilized current, which accommodate enthusiasts ' needs in OC or Gaming. DFI UT P35 series provides sufficient current for the processor. Aside from this, the new heat dissipating fins of the PWM circuit further stabilize current flow to the system.

The cutting-edge audio solution- "Bernstein Audio"
Leonard Bernstein, best-known conductor and music composer of USA i n 50's of 20 century. Bernstein represents the supreme authority of classical music in Northern America. LP UT P35 series is equipped with this brand new "Bernstein Audio" module. In fact, the board's designer uses a new way to generate this module. For easier installation, designer moved this module close to "PCI slots area" for easy to mount in PCI bracket. Second, it obtains a perfect noise reduction than Karajan's. As all we know, no matter Pro-gamers or power users who used to enjoy music and movie with their PCs must have highly requests about the quality of their audio output device. Hence, how much the noise can be reduced is what they concerned about in high priority. DFI's Bernstein audio module is intents to improve this kind of issue; it uses a unique way to separate the "signal" of audio module and motherboard, which makes the electric interfere of audio output decrease to minimum level.
Bernstein audio adopts Realtek ALC885 high definition codec. It is certified by Microsoft Vista Premium. In addition, ALC885 features a DAC SNR of 106dB and ADC SNR of 101dB. Then, the codec also supports sampling at highest 192 KHz, 10 DAC channels, 3 Stereo ADC channels (7.1 + 2 channels) and 24bit PCM. Besides, it provides "Full-rate Lossless Content Protection Codec", which's able to decrypt Content Protection for HD-DVD in the future, if not; the sound quality of DVD will be a step lower than the standard.

Supports DDR2/ DDR3 memory
The substitution of memory's each generation is being faster and faster. We still remember that; the market leads us to replace our memory to DDR2 while we're just used to use DDR. Then, we're finally figure out what exactly DDR2 is, meanwhile, the module manufacturer teaches us to choice DDR3 and try to say goodbye to DDR2. Hence, DFI is considerate of power users' unique demand. LP UT P35 series is ready to launch DDR2 and DDR3 models to satisfy power users' request. The LP UT P35 T3R (DDR3) will be launch into market right after LP UT P35 T2R.

Versatility BIOS options
Enthusiasts are always found great pleasure when they are able to squeeze a little more performance from their system through overclocking. For this reason, the designer of DFI LP UT P35-T2R offers a versatility BIOS options for enthusiasts to enjoy during they overclocking. So, the voltage options are the key point, which includes: memory voltage options, NB & SB options, CPU Vcore option and HT voltage options. That would make enthusiasts an unlimited OC environment. Besides, the unique CMOS Reload can help users to store different OC settings in BIOS. Further, LANParty series motherboard adopts high quality capacitors and components for an advance OC "physical structure".

Teaming function & Dual Gigabit LAN
At the very beginning, LANParty series provides Dual gigabit LAN to gamers as a basic feature. Nowadays, it is almost a "must" when users want to grab information such like DVD content, huge capacity games or fighting with buddies on LAN game. For that reason, DFI LP UT P35-T2R provides another unique function to all the heavy user of Internet/ LAN - the Teaming function. It makes the dual LAN Ports' bandwidth to combine together as one. Then the bandwidth will be two times large than original one. Moreover, if one of the LAN port crashed, the other one will be carry on the processing task over Internet or LAN. Therefore, teaming function is brings you a wider and safer LAN transmission environment.

Source : DFI